After Intel rolled out its next generation Corei7 processors, many memory device manufacturers are vying to be among the first to push out their compatible memory storage devices with 3-channel architecture. Continue Reading
Tag Archive | "aluminum heat"
Tags: aluminum heat, channel memory, core, DDR3, ddr3 memory, desktop, heat dissipation, Intel, layer pcb, memory, memory device, memory ram, memory storage, next generation, OC, processor, team elite, Team Group, technology
Team Elite DDR3 – Triple channel memory
Posted on 20 March 2009 by Ventus
Tags: 2gb, a-data, aluminum heat, boot, cebit, cl7, cooler, DDR3, dual fan, fan cooler, heat dissipation, heat spreaders, high speed, latency, memory, memory chips, noise level, OC, overclock, overclocking, pc, RAM, superpi, system boot, technology, XPG
A-DATA Demonstrate XPG DDR3-2133X v2.0 Triple Channel Module at CeBIT 2009
Posted on 06 March 2009 by Ventus
A-DATA, showcasing its leading triple channel module in the industry at CeBIT 2009 in Hannover, Germany. Continue Reading
Tags: a-data, aluminum, aluminum heat, DDR3, dual channel, gamer, heatspreaders, high quality, memory, memory chips, memory modules, pc enthusiasts, performance modules, power consumption, RAM, system boot, triple-channel, XPG
A-DATA expands its XPG Plus Series with DDR3-1800+
Posted on 03 December 2008 by Ventus
A-DATA, announced today that it is launching A-DATA XPG DDR3-1800+ of its Plus Series right after DDR3-1600+. DDR3-1800+ is available in dual channel kits, 1GBx2 and 2GBx2, as well as in triple channel retail packs as 2GBx3 and 1GBx3. Continue Reading
Tags: airflow, aluminum heat, aluminum heat sink, AM2, AMD, cooler, core i7, CPU coolers, Dual-Core, gaming, gaming solution, GlacialTech, heat pipe, heat pipes, Intel, Intel Core i7, performance
UFO V51 Gaming Solution Cooling
Posted on 27 November 2008 by Ventus
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| GlacialTech, today announced the launch of UFO V51 range of CPU coolers for the and high-end AMD CPUs, designed for gaming and other high I/O applications. Continue Reading |
