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Team launches Triple Channel Xtreem DDR3

Posted on 04 December 2008 by Ventus

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Team launches Triple Channel Xtreem DDR3 ahead of others Triple bandwidth, X-tiple speed

Team Group has launched various tri-channel products of high frequency and low latency ahead of its competitors with unrivalled capacity, including Xtreem DDR3 1866 and Xtreem Dark 1600/1333, to shock the DDR3 market and cope with the advent of the Intel Core i7 platform

After winning countless praise and awards for the DDR3 1800 and DDR3 2000 modules, the Xtreem DDR3 tri-channel module from Team has become the key of the next-gen Core i7 platform. In memory architecture, the Core i7 has enhanced the frequency from DDR3 1333 to DDR3 1866. In addition to increasing the speed by nearly 30%, the tri-channel layout has an expanded bandwidth to 44GB/Sec for the Team Xtreem DDR3 1866 to exert its “market-fastest” advantage. The Xtreem Dark DDR3 1600 and DDR3 1333 are low-latency models in 8-8-8-24 and 7-7-7-21 timings (tCL-tRCD-tRP-tRAS) respectively on 1.65V. These have displayed Team’s unrivaled R&D capacity.

All Xtreem DDR3 tri-channel modules from Team are made with genuine BGA chips in 128×8 configurations. They are available in 6GB (3 x 2GB) and 3GB (3 x 1GB) kits to meet the capacity needs of different users. A tradition of Team, all tri-channel memory modules are produced in under strict quality control and must pass vigorous tri-channel tests before shipping to ensure that every module has excellent, stable and reliable performance. Also, Team has equipped them with brand-new, fashionable black aluminum heatsinks which present an exquisite appearance with the unique X-shaped type design to mark out the eXtreme performance of the product.

In addition to the genuine chips, Team has invented the exclusive sorting technology to maintain the extreme quality of chips. All modules must pass a 24-hour burning test on major overclocking motherboards from ASUS and Gigabyte before shipping to ensure that they can run at DDR3 1866 or even faster. Also, all tri-channel models from Team are equipped with the built-in XMP (Extreme Memory Profiles) function to ensure that anyone can overclock with them. If you are interested in learn more about the Team Triple Channel Xtreem and Dark series, visit our site.

Team Xtreem DDR3 1866 Triple Channel Specification

Item Specification
Suitable for Desktops
Module Type 240Pin Unbuffered DIMM Non ECC
DRAM Density 128×8
Capacity 3GB Kit (3×1GB)?6GB Kit (3×2GB)
Data transfer
bandwidth
14,928MB/Sec (PC3 15000)
CL-value 9-9-9-24-2T
Working voltage 1.65V
PCB 8-layer PCB
Warranty Lifetime warranty

Team Xtreem Dark DDR3 1600 Triple Channel Specification

Item Specification
Suitable for Desktops
Module Type 240Pin Unbuffered DIMM Non ECC
DRAM Density 128×8
Capacity 3GB Kit (3×1GB)?6GB Kit (3×2GB)
Data transfer
bandwidth
12,800MB/Sec (PC3 12800)
CL-value 8-8-8-24-2T
Working voltage 1.65V
PCB 8-layer PCB
Warranty Lifetime warranty

Team Xtreem Dark DDR3 1333 Triple Channel Specification

Item Specification
Suitable for Desktops
Module Type 240Pin Unbuffered DIMM Non ECC
DRAM Density 128×8
Capacity 3GB Kit (3×1GB)?6GB Kit (3×2GB)
Data transfer
bandwidth
10,664MB/Sec (PC3 10600)
CL-value 7-7-7-21-2T
Working voltage 1.5V~1.6V
PCB 8-layer PCB
Warranty Lifetime warranty
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